Open AccessDamage Degree analysis of storage failure modes for plastic encapsulated microelectronic devices
Author(s) -
Hang Ju,
Shuang Liu
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2132/1/012048
Subject(s) - failure mode, effects, and criticality analysis , failure mode and effects analysis , reliability engineering , reliability (semiconductor) , corrosion , microelectronics , failure causes , computer science , forensic engineering , materials science , engineering , composite material , electrical engineering , power (physics) , physics , quantum mechanics
After long-term storage, plastic sealing devices must have good performance when installed on the whole machine. Identifying the risk of failure mode and taking preventive measures before failure can effectively improve storage reliability. To ensure the quality of military products, this paper studies the storage failure modes of plastic sealed micro-electronic devices, and uses the method of FMECA to calculate the damage degree of each failure mode and determine the key failure modes. The case analysis shows that the damage degree of failure mode is ranked as external lead corrosion, aging of packaging material, chip corrosion and bonding ball corrosion. The evaluation result accords with the actual situation of the method. The improved FMECA model can better deal with the relative importance of risk factors, improve the accuracy of risk ranking, and quantify risks more reasonably.