Open AccessInfluence of the Agitation Pipe on the Flow Field of Electroplating Tank in the Electroplated Diamond Wire Saw
Author(s) -
Derong Duan,
Peng Ge,
Zhenfeng Gong,
Fuli Huang,
Guangzhou Cao
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2125/1/012063
Subject(s) - electroplating , inlet , materials science , diamond , flow (mathematics) , composite material , metallurgy , mechanics , mechanical engineering , engineering , layer (electronics) , physics
In order to solve the problem of diamonds sedimentation in electroplating tank and uneven distribution of diamonds in coatings, the fluid flow in the electroplating tank formed by three structure kinds of agitation pipe was compared and analysed. Results showed that the middle inlet type agitation pipe can significantly improve the fluid uniformity in the electroplating tank, and setting sand blasting ports at both ends of the agitation pipe can avoid the formation of fluid “dead zone”. Along the direction of the agitation pipe, the middle inlet type agitation pipe improves the overall flow of the fluid. In the position of the wire saw passing through, the difference of the speed in the electroplating tank of the middle inlet type is 47.17% and 15.25%, which is significantly lower than that of the water inlet structure of one end by 134.48%. As a result, it can significantly improve the plating effect of the wire saw.