Open AccessDesign of a Ku-band Tile T/R Module
Author(s) -
Yu Zhang,
Hailong Zhao,
Xuefeng Song,
Zenglu Li
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2121/1/012002
Subject(s) - ku band , interconnection , miniaturization , tile , reliability (semiconductor) , computer science , chip , channel (broadcasting) , electronic engineering , reliability engineering , engineering , electrical engineering , materials science , telecommunications , power (physics) , physics , quantum mechanics , composite material
This paper introduces a 16 channel Ku-band tile T/R module design in 3D highly integrated packaging. The technical indicator design of T/R module is completed by using four channel amplitude phase multifunctional chip and various design methods. Through reasonable indicator distribution and structure layout, the miniaturization design of T/R module is realized by using high-density substrate and 3D interconnection structure. Through process optimization, structural design and simulation verification, the reliability and producibility of T/R module is studied, and the consistency of products is improved. The test results show that the design has good microwave performance and can meet the requirements of high performance, low cost and batch production of Ku-band T/R module.