Open AccessReliability Design and Simulation of High Density Packaging T/R Module
Author(s) -
Hailong Zhao,
Yu Zhao,
Honglei Ran,
Hao Peng,
Kui Zhang,
Yin Liang
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2121/1/012001
Subject(s) - reliability engineering , reliability (semiconductor) , compatibility (geochemistry) , computer science , thermal management of electronic devices and systems , engineering , mechanical engineering , power (physics) , physics , quantum mechanics , chemical engineering
The requirements, development, packaging characteristics and existing reliability problems of high density packaging T/R modules are introduced, and the importance of reliability design is recognized. Aiming at the reliability problems of Electro Magnetic Compatibility (EMC), heat dissipation and electrostatic discharge, the reliability design and simulation scheme are given, and some cases are provided. Through design analysis and improvement, the reliability of 3D high density packaging T/R modules can be effectively improved.