Open AccessExperimental Study on the Properties of Copper Base Alloy by Laser Cladding on the Surface of Pure Copper Contact
Author(s) -
Shouhong Xue,
Baokun Li,
WU Jiguang,
Lihong Ge,
Zhengping Gao,
Yaoguo Yang,
Jiaxuan Li
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2101/1/012079
Subject(s) - copper , materials science , cladding (metalworking) , alloy , metallurgy , tungsten , microstructure , corrosion , composite material , contact resistance , dilution , layer (electronics) , physics , thermodynamics
Arc ablation is the main reason for the failure of pure copper switches. In order to improve the electric ablation resistance of pure copper contacts, Cu-W-Ni alloy cladding layers with different tungsten contents were prepared on the surface of pure copper matrix by laser cladding technology. The microstructure, composition distribution, hardness and corrosion resistance of the cladding layer were analyzed. The results show that the surface of the cladding layer and the pure copper matrix is metallurgical, without holes, cracks and other defects, and the dilution rate is low, and the average hardness is significantly increased. On the whole, the comprehensive properties of CuW10Ni3 cladding layer are slightly better than the other two Cu-W-Ni cladding layers. Compared with the pure copper matrix, the contact hardness is significantly improved under the premise of ensuring the electric conductivity of the inner pure copper matrix.