Open AccessThe Influence of a 3D Model of a Radio Electronic Component on Thermal Simulation
Author(s) -
А В Башкиров,
V. V. Glotov,
I.S. Bobylkin,
Yu. S. Balashov,
A S Kushnarev
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2096/1/012052
Subject(s) - component (thermodynamics) , electronic component , printed circuit board , electronics , transistor , power electronics , heat sink , power (physics) , thermal , radiator (engine cooling) , cad , process (computing) , mechanical engineering , electronic circuit simulation , electrical engineering , computer science , electronic engineering , engineering , electronic circuit , engineering drawing , physics , quantum mechanics , voltage , meteorology , thermodynamics , operating system
Very often, when designing and developing radio electronic devices, engineers are regularly faced with the need to solve various kinds of problems to ensure the operation of a product under the required mechanical loads or thermal conditions during operation. One of the main issues that arise when conducting thermal modeling of radio electronics is the correct assessment of the results. There are a number of electronic components that need to be cooled, mainly through a printed circuit board: power supply transistors, power diodes, microcircuits, etc. For such elements, 90% (or more) of the heat flux from the component is diverted through the printed circuit board, and then to the radiator. Therefore, when carrying out the simulation, it is necessary to have previously obtained reliable temperature results on the power elements. The use of a detailed 3D model for modeling is most often unjustified and can introduce certain errors in the calculations. This article compares different 3D transistor models and the effect of detailing on the modeling process in CAD SolidWorks.