Open AccessNumerical simulation of the condensation process in high voltage switchgear based on the temperature and humidity distribution
Author(s) -
Peng Wang,
Jingwen Sun,
Pipei Zhang,
Jiangwei Wang,
Zhijun Zhao
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2087/1/012082
Subject(s) - switchgear , humidity , circuit breaker , condensation , bushing , materials science , relative humidity , mechanics , electrical engineering , engineering , composite material , thermodynamics , physics
The condensation on solid materials surface inside switchgear is an important reason threatening its safety and reliability. The formation of condensation is closely related to the temperature and humidity distribution inside the switchgear. A 3-D simplified finite element calculation model for the switchgear is established, including the bus bar, the wall bushing, the circuit breaker, the cables and other key components. Based on the electromagnetic-temperature-humidity multi-physical field coupling method, the temperature distribution inside the switchgear are calculated when the operating current flows through the bus-bar. Furthermore, the humidity diffusion process is also calculated when the relative humidity of external environment was 0.8, and the relative humidity inside the switchgear is obtained. The calculation results show that the surface humidity of the contact box of the circuit breaker is the highest whereas the temperature is the lowest, which is the location where the condensation is easy to occur.