Open AccessResearch on Structure Integration and Thermal Control Technology of RF Microsystem
Author(s) -
Jianfeng Zhong,
Zihao Yang,
Liangchen Tan,
Shouli Jiang
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2083/2/022096
Subject(s) - microsystem , multiphysics , radio frequency , system integration , vertical integration , process (computing) , key (lock) , systems engineering , volume (thermodynamics) , engineering , thermal , computer science , mechanical engineering , electronic engineering , electrical engineering , materials science , nanotechnology , physics , computer security , structural engineering , quantum mechanics , finite element method , meteorology , law , political science , operating system
The urgent demand for small volume and light weight of APAR brings new challenges to the integration of radio frequency (referred to as RF) structure. This paper reveals the importance and characteristics of RF microsystem structure integration. Then the new challenges and key technologies in the process of microsystem integration are studied, such as system level thermal management and application of high thermal conductivity, multiphysics simulation and so on. In the end the further thinking of the integration and thermal management technology is illustrated.