Open AccessUltrasound-Assisted Surface Modifications on Ceramic Reinforcement for Lead-Free Composite Solders : Short Review
Author(s) -
Wai Keong Leong,
Ahmad Azmin Mohamad,
Muhammad Firdaus Mohd Nazeri
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2080/1/012025
Subject(s) - materials science , ceramic , soldering , wetting , reinforcement , composite number , composite material , surface modification , mechanical engineering , engineering
The purpose of this paper is to review and examine the effect of ultrasound-assisted surface modifications of ceramic reinforcements on the properties of lead-free solders. The discussion will highlight the fundamental understanding, main parameters, configurations, and recent surface-modified ceramic reinforced composite lead-free solder developments. The review also identified and summarized the advantages, current trends, and significant findings in this field. The ultrasound-assisted surface modification was found to provide a crucial improvement on the wettability properties of molten solders as the matrix phase on the ceramic reinforcement. Further, the excellent distribution of ceramic reinforcement in solder matrix was also seen after the surface modification process. This has led to significant improvements in mechanical properties such as hardness and strength. The pinning of dislocation movement was seen as the reason for improving the mechanical properties. This positive impact in enhancing the ceramic reinforcement-solder interfacial reaction allows more explicit future research directions and opportunities for composite solder applications.