
Effect of infill density and raster angle on the mechanical properties of PLA
Author(s) -
Mei Ai Tan,
Cheow Keat Yeoh,
Pei Leng Teh,
Nam Rahim,
Cheah Chie Song,
Nor Shahira Shahkila Mansor
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2080/1/012002
Subject(s) - materials science , polylactic acid , ultimate tensile strength , raster graphics , composite material , infill , thermoplastic , young's modulus , modulus , polymer , structural engineering , computer science , engineering , artificial intelligence
Polylactic acid (PLA) is derived from natural aliphatic polyester resources for instance sugarcane or starch based plants. PLA also known as a biocompatible and biodegradable thermoplastic and found widely in multiple applications like electronic and electrical devices, biomedical, food packaging and the engineering field. PLA have attracted attention in production potential due to its superior attributes like ease of processing, high strength and high modulus. Infill density, raster angle and infill pattern can influence the mechanical characteristics of materials like PLA, acrylonitrile-butadiene-styrene (ABS), polyetheretherketone (PEEK). In this paper, the relationship between infill density and raster angle was studied to investigate the mechanical performances of PLA by using 3D printers. 3D printing is used to fabricate more complex 3D design objects. The tensile test was involved to evaluate the properties of pure PLA. For pure PLA, 0° raster angles with 100% infill density show the highest tensile strength and Young’s modulus which are 28.926MPa and 1262.7MPa respectively. However, a decreasing trend of break elongation reveals in PLA as infill density increases for both 0° and 90° raster angle. Optimization of printing parameters become crucial to provide high quality materials for 3D printing in order for education, packaging, engineering and biomedical applications.