Open AccessResearch on Thermal Fatigue Life Prediction Technology of PoP Laminated BGA Products
Author(s) -
Honglei Ran,
Xiao-jie Sheng,
Qiang Duan,
Kui Zhang,
Jie Huang
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2065/1/012017
Subject(s) - ball grid array , soldering , joint (building) , materials science , finite element method , daisy chain , thermal fatigue , stress (linguistics) , structural engineering , thermal , composite material , engineering , electrical engineering , linguistics , physics , philosophy , meteorology
In this paper, a fast prediction method for thermal fatigue life of PoP laminated BGA Product was proposed. Firstly, the stress and strain of the solder joints of each layer of the laminated device in thermal fatigue test was determined by finite element simulation method. According to the research idea of relative stress and strain, the solder joints were divided into sensitive solder joints and reliable solder joints. Secondly, sensitive solder joint were connected with PCB traces through the internal pads, bonding wires, TSVs and reliable solder joints to form a daisy chain. Through real-time dynamic monitoring of the resistance change of the daisy chain in thermal fatigue test to judge whether the solder joints fail, and record the occurrence time of the first failure solder joint. Finally, the thermal fatigue life of the product was estimated by the Norris-Landzberg formula.