Open AccessGrowth behaviors of IMCs in low-silver lead-free Sn1.0Ag0.5Cu micro-joints for long-term high-temperature environments
Author(s) -
Duanpeng He,
Yan Li,
Ruoyuan Qu,
Xiangtian Yu,
Bing Wu,
Hong Gao
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2044/1/012061
Subject(s) - soldering , materials science , intermetallic , lead (geology) , welding , microstructure , reliability (semiconductor) , metallurgy , composite material , thermodynamics , power (physics) , physics , alloy , geomorphology , geology