Open AccessDevelopment of Computer Intelligent System-Level Electronic Integrated Package Microsystem Technology
Author(s) -
Hao Lv,
Bao Deng,
Shi Chen-guang
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2033/1/012140
Subject(s) - microsystem , system integration , microelectronics , systems engineering , integrated circuit , engineering , miniaturization , packaging engineering , manufacturing engineering , field (mathematics) , computer science , electrical engineering , mechanical engineering , nanotechnology , materials science , mathematics , pure mathematics , operating system