Open AccessPCB board heat transfer model based on heat transfer mechanism analysis
Author(s) -
Sai Gu,
Dawei Xue,
Bo-Jian Liang,
L X Chen
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2014/1/012013
Subject(s) - heat transfer , printed circuit board , process (computing) , temperature control , mechanical engineering , materials science , computer science , mechanics , engineering , electrical engineering , physics , operating system
Temperature control plays a vital role in the circuit board production process. In order to control the temperature change in the reflow oven, we establish a differential equation model of the PCB heat transfer based on the theory of heat transfer and use the boundary conditions to solve the temperature distribution in the oven. We also accurately simulate the heating and cooling process of the PCB. According to the requirements for the shape of the oven temperature curve in actual production, we respectively use the heating factor and the area enclosed by the temperature as evaluation indicators, establish a target optimization model, and obtain the best set temperature for each temperature zone and the best transmission speed of PCB board. Through analysis of different cases, we could get the conclusion that the model in this paper is reasonable and effective.