Open AccessOptimization of the curing modes of three-layer honeycomb panels
Author(s) -
Yanyang Chen,
G. V. Malysheva
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1990/1/012074
Subject(s) - materials science , composite material , curing (chemistry) , epoxy , foil method , adhesive , composite number , honeycomb structure , epoxy adhesive , aluminium , honeycomb , layer (electronics)
In this paper, a method of determining rational regimes of the process of curing structures made of polymer composite materials and honeycomb filler was developed. The subject of the study was a three-layer panel where the top and bottom layers were made from carbon fiber, while the honeycomb filler was made from aluminum foil. The filler was bonded to the top and bottom layers with epoxy film adhesive. Using numerical simulation, temperature state, curing degree, and heat generation rate of all the elements of the three-layer panel were determined. The simulations revealed that the process of curing the considered honeycomb structure was uneven due to uneven temperature distribution. The optimal process modes ensuring the gradients of the degree of cure were established.