Open AccessNumerical Simulation of Optimizing Plating Uniformity of Interconnect Circuits on Printed Circuit Boards
Author(s) -
Jing Xiang,
Panfeng Chen,
Yingjie Wang,
Chong Zeng,
Wei Yang,
Jie Li,
Yuanzhong Xu
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1986/1/012135
Subject(s) - plating (geology) , interconnection , printed circuit board , cathode , electronic circuit , electroplating , materials science , copper plating , shield , anode , aperture (computer memory) , electronic engineering , electrical engineering , mechanical engineering , computer science , engineering , electrode , composite material , telecommunications , physics , petrology , layer (electronics) , quantum mechanics , geophysics , geology
Based on the finite element method, the interconnection circuit models with different pattern designs were established and plating copper circuits were simulated to obtain the plating uniformity. Meanwhile, the influence of insulating shield, auxiliary cathode and the distance between anode and cathode (DAC) on the plating uniformity is studied to provide theoretical guidance for improving the uniformity of electroplating copper at actual production. Compared with other pattern designs, the circuit with a pattern design area ratio of 20% has the best plating uniformity under the initial conditions. The increase in the auxiliary cathode width and the decrease the aperture of insulating shield and DAC can improve the electroplating uniformity of circuit.