Open AccessThermal Performance Simulation of Novel Micro Heat Pipe
Author(s) -
Haiwei Ji,
Yaping Zhang,
Fang Wang,
Zhangdong Jin
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1936/1/012025
Subject(s) - heat pipe , materials science , thermal conduction , micro loop heat pipe , heat flux , heat spreader , heat sink , heat transfer , mechanics , thermal , thermal conductivity , thermal resistance , loop heat pipe , mechanical engineering , thermal diffusivity , thermodynamics , composite material , engineering , physics
In this paper, a mathematical model of micro-heat pipe module is established, and the thermal performance of micro-heat pipe module under different heating power and different heat conducting fins is studied by numerical simulation method. The simulation results show that the maximum temperature difference on the substrate surface of the micro-heat pipe is within 2.5 °C, and the micro-heat pipe can effectively diffuse the concentrated heat source and has excellent temperature uniformity characteristics at high heat flux. Further, The influence of heating power and heat conduction fins on the heat transfer performance of the micro-heat pipe module has been analyzed. It is found that the thermal diffusion performance of the micro-heat pipe module reaches the optimal when the heat flux density is 180W and the heat conduction fins are 20 pieces. Simulation shows that the micro-heat pipe module can avoid the thermal stress concentration of the substrate to the greatest extent, thus ensuring the efficient and stable operation of the power module.