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Process Defects and Failure Analysis Methods of Crystal Oscillator
Author(s) -
Cong Liu,
Yancai Gao,
Xiuming Cai,
Wenjuan Zhou,
Jian Zou
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1885/2/022040
Subject(s) - process (computing) , waveform , materials science , vibration , crystal (programming language) , computer science , reliability engineering , engineering , acoustics , voltage , physics , electrical engineering , programming language , operating system
The common failure modes of crystal oscillators are vibration stop, waveform abnormality and frequency drift, there are many failure mechanisms, some of which are related to process defects, such as chip process defects, module packaging process defects and crystal process defects. In order to discover the process defects, summarize the performance, appearance, reason and failure analysis methods of its common process defects is necessary. Introduced several common process defects of current SMD crystal oscillators and corresponding analysis methods through specific case analysis.

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