
Maximum heat fluxes and features of heat transfer mechanisms with boiling during jet impingement cooling of electronics
Author(s) -
Maxim V. Pukhovoy,
K A Kunts,
Serafim Spesivtsev,
Oleg Kabov
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1867/1/012036
Subject(s) - heat transfer , microelectronics , boiling , critical heat flux , jet (fluid) , heat flux , materials science , heat transfer enhancement , mechanical engineering , computer cooling , nucleate boiling , mechanics , boiling heat transfer , electronics , enhanced heat transfer , heat transfer coefficient , nuclear engineering , thermodynamics , nanotechnology , thermal management of electronic devices and systems , engineering , electrical engineering , physics