Open AccessStudy on Preparation of Nano-porous Copper by Dealloying Method
Author(s) -
Zhiwei Wang,
Mingyu Li,
Qingxuan Zeng
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1838/1/012078
Subject(s) - copper , materials science , porosity , metallurgy , corrosion , sintering , nanoporous , hydrochloric acid , oxalate , specific surface area , alloy , oxalic acid , chemical engineering , inorganic chemistry , composite material , chemistry , catalysis , nanotechnology , biochemistry , engineering
Nano-scale mixed powdercomposed ofoxalate copperand oxalate manganesewas prepared by chemical synthesis method, after tableting, it was sintered at high temperature in a tube furnace under the protection of nitrogen to obtain nano-level Cu-MnO alloy. The Mn is removed by corrosion to obtain nanoporous copper. The solid copper-manganese oxalate was analyzed by TG/DTG. The specific surface area and composition of porous copper before and after sintering and dealloying were analyzed and characterized by using automatic specific surface area analyzer and ICP-OES. The results show that the specific surface area of the copper-manganese alloy can be greatly improved by controlling the sintering temperature so that it is not completely decomposed. The specific surface area of porous copper obtained when the Mn element is 14% (mole fraction) is the largest. After hydrochloric acid corrosion, the specific surface area of porous copper will be significantly reduced, and hydrochloric acid dealloying is a continuous process. If the corrosion concentration and time are too small, the purity of the porous copper will be lower. Converselyif ttheyare too large, the porous copper structure will collapse and the specific surface area will quickly decrease. Nano-porous copper with a specific surface area of 75.9 m 2 /g can be obtained by etching in 0.5mol/L HCl for 4 h.