Open AccessInfluence of eccentric nanoindentation on top surface of silicon micropillar arrays
Author(s) -
Prabowo Puranto,
Qiang Zhang,
Wilson Ombati Nyang’au,
Jannick Langfahl-Klabes,
Jan Thiesler,
Mutaib Zackaria,
Zhi Li,
Hutomo Suryo Wasisto,
Erwin Peiner,
Uwe Brand
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1837/1/012008
Subject(s) - nanoindentation , materials science , indentation , silicon , pillar , composite material , modulus , nanoindenter , diamond , nanotechnology , optoelectronics , structural engineering , engineering
In this paper we present an investigation of the influence of nanoindentation location on the top surface of silicon micro-pillar. This silicon micro-pillar array which will be employed as a micro force sensor array based on three-dimension silicon (3D Si) structures, is fabricated by near UV nanoimprint lithography (NIL) technique and etched by Cryogenic Inductively Coupled Plasma (ICP) sequentially. To determine its mechanical properties, those micropillars are measured by instrument indentation testing (IIT) to obtain its hardness and reduced modulus. For the measurement, a Berkovich diamond indenter is utilized to penetrate a single and also multiple point indentations on a micro-pillar surface. Afterwards, these results are compared to the indentation at the central point of the tested pillar and Si bulk as its reference to examine the influence of different probing locations on the measured reduced modulus and hardness.