Open Access5G Transceiver Component Cell-packing Fabrication for Wireless Data Transmission Using LTCC Technology
Author(s) -
Junchao Liu,
Shuai Liu
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1813/1/012037
Subject(s) - transceiver , fabrication , component (thermodynamics) , wireless , electronic engineering , transmission (telecommunications) , electronic component , materials science , electrical engineering , engineering , telecommunications , medicine , physics , alternative medicine , pathology , thermodynamics
As an attractive electronic component fabrication method, LTCC technology has been widely used for the creation of highly integrated components in advanced manufacturing field. In this paper, a fabrication method of 5G transceiver component cell-packing was presented using LTCC technology. RF and capacitor chips were also bonded to the cell-packing for electrical performance test. The experimental results showed that the actual dimensions of cell-packing had little differences from the design dimensions, and the cell-packing coating had good solderability. Through electrical performance test, the core electrical performance indicators of 5G transceiver component, such as signal gain and output power, were reasonable over the whole operating frequency band. It indicated that the cell-packing can be applied to 5G transceiver component in satellite communications for wireless data transmission.