Open AccessApplication of time-varying heat transfer model
Author(s) -
Ting Zhang
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1802/2/022004
Subject(s) - thermal conduction , heat transfer , fourier transform , variable (mathematics) , heat equation , fourier number , process (computing) , production (economics) , boundary (topology) , object (grammar) , computer science , relativistic heat conduction , boundary value problem , mechanics , mechanical engineering , heat transfer coefficient , mathematics , thermodynamics , physics , mathematical analysis , engineering , artificial intelligence , heat flux , economics , macroeconomics , operating system
The process of heat conduction has important practical significance in industrial production. This paper takes the central temperature of electronic components as the research object, uses the Fourier one-dimensional heat conduction equation and the separation variable method, uses Newton’s cooling law to deal with the boundary conditions, studies the heat transfer model of electronic components, and three-dimensional problems become one dimensional problem, thus providing some feasible ideas for improving industrial production.