Open AccessAgile development technology of test application program suitable for semiconductor device testing
Author(s) -
Tao Yan,
Min Guo,
Xinxiang Zhu,
Yang Yang
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1792/1/012021
Subject(s) - agile software development , component (thermodynamics) , reuse , computer science , test (biology) , systems engineering , embedded system , reliability engineering , engineering , software engineering , paleontology , physics , biology , thermodynamics , waste management
The semiconductor devices (especially integrated circuits/chips) test field involves a wide range of device types and test parameters, which leads to low development efficiency, poor stability, weak reuse, long development cycle and repetitive work in application development. Therefore, a test application development method based on reusable component technology is proposed in this paper. Firstly, this paper introduces the basic concepts and characteristics of the reusable component technology. Then, according to the current situation of semiconductor device testing, the design method of component-based test application program is described. Finally, the typical semiconductor device test application program is designed and developed by using LabWindows/CVI integrated development environment. Practice has proved that the component-based test application program design can speed up the R&D and ensure the software quality at the same time. The agile development requirement of application program for semiconductor device test system can be satisfied.