Open AccessEffect of substrate annealing on wetting behavior and interfacial reaction between Sn-0.7Cu and amorphous Fe84.3Si10.3B5.4 alloy
Author(s) -
Bin Hou,
H Q Wang,
Y P Zhang,
H Y Wang,
Chaojiao Zeng,
Bei Wu
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1777/1/012023
Subject(s) - wetting , sessile drop technique , materials science , annealing (glass) , contact angle , scanning electron microscope , soldering , alloy , amorphous solid , substrate (aquarium) , drop (telecommunication) , metallurgy , composite material , analytical chemistry (journal) , chemical engineering , crystallography , chemistry , chromatography , oceanography , geology , telecommunications , computer science , engineering
Wetting behaviors of Sn-0.7Cu on amorphous Fe 84.3 Si 10.3 B 5.4 substrate and substrates annealed at various temperatures (i.e., 400 °C, 500 °C and 650 °C ) were investigated at 250 °C, 300 °C, 350 °C and 400 °C by the sessile drop method, and the interfacial reaction of Sn-0.7Cu on different Fe 84.3 Si 10.3 B 5.4 substrates with different annealing treatments were studied by scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS). Obtained results show that at the same soldering temperature, the final equilibrium wetting angle of Sn-0.7Cu on Fe 84.3 Si 10.3 B 5.4 substrates gradually increases with the increase of annealing temperature. That means the wettability becomes worse and the interfacial reaction becomes weaker. With the increase of soldering temperature from 250 °C to 400 °C, the final equilibrium wetting angle of Sn-0.7Cu on Fe 84.3 Si 10.3 B 5.4 substrates decreases gradually, suggesting a better wettability.