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Research on Intelligent Assembly Modes of Aerospace Products Based on Digital Twin
Author(s) -
Shi Li,
Yan Liang,
Bai Shu-qing,
Zhuang Cuobo,
Cao Yuanchong
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1756/1/012011
Subject(s) - aerospace , layer (electronics) , software , computer science , application layer , process (computing) , scalability , systems engineering , service layer , engineering , embedded system , distributed computing , database , operating system , chemistry , organic chemistry , middleware (distributed applications) , aerospace engineering
Based on the multi-varieties and scalable batch production mixed line assembly of aerospace products, this paper proposes the technical approach and system architecture of an intelligent assembly integration platform which is composed of hardware layer, software layer and application layer from bottom up, so as to construct an intelligent assembly integration application platform based on the digital twin. Hardware layer is composed of the equipment and communication, software layer mainly includes the database and functional modules, and application layer is constructed based on a digital twin model, realizing visual monitoring of the assembly process. This paper establishes an intelligent monitoring mode based on digital twin and an intelligent control mode based on two-layer optimization. At the workshop layer, a digital twin mode of entities is constructed so as to form a plan optimization information, logistics optimization information and quality optimization information, and post control optimized execution information is sent back to the workshop operational layer. At the assemble line layer, real-time information is acquired, equipment monitoring is realized, and optimized information is sent back to the workshop operational layer, achieving control and optimization of assembly lines. This paper reshapes processes under this intelligent assembly mode; and verify its application in aerospace product assembly.

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