
Analysis of adhesion mechanism of 220kV double-split conductor based on response surface method
Author(s) -
Zhiqing Xu,
Fan Gao,
LiMing Chu
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1754/1/012018
Subject(s) - conductor , adhesion , electrical conductor , mechanism (biology) , surface (topology) , matlab , span (engineering) , structural engineering , materials science , mechanics , computer science , physics , engineering , composite material , mathematics , geometry , quantum mechanics , operating system
In order to analyze the adhesion mechanism of 220kV double-split conductors, this paper proposes 4 adhesion factors, including ice thickness, wind speed, span, and initial spacing. Firstly, the mathematical model of wire adhesion is established; then, the iterative method in MATLAB software is used to solve the mathematical model; finally, response surface method is used to analyze the influence of the interaction among the 4 factors on the wire adhesion. The analysis results show that too small initial spacing is the main factor causing conductor adhesion; under the joint action of initial spacing and span, conductor adhesion is most likely to occur.