Open AccessProcess simulation of nano-channel forming by thin film deposition
Author(s) -
Jian Jin,
Si Di,
Hao Wang,
Xiaojun Li,
Xudi Wang,
Xuetong Sun
Publication year - 2020
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1699/1/012023
Subject(s) - deposition (geology) , channel (broadcasting) , materials science , fabrication , process (computing) , nano , nanotechnology , thin film , mechanical engineering , composite material , computer science , engineering , electrical engineering , geology , paleontology , operating system , medicine , alternative medicine , pathology , sediment
In the traditional fabrication process of micro/nano-fluidic chips, thermal bonding is usually used for channel sealing, but it is easy to cause channel blockage, especially when the channel size is nanometer. The film deposition is a better way to seal the nano channel, and by controlling the deposition angle, the shape and size of the sealed channel can also be controlled. In order to understand the channel formation process of thin film deposition more intuitively, based on the COMSOL software, a free molecular flow module is used to simulate the film deposition process. The growth of the film is characterized by the post-processing of geometric deformation, so as to predict the channel shape. By comparing the simulation results with the experimental results, it can be seen that this simulation can explain the process of forming channels by angle-deposited films to a certain extent, and predict the channel size. In addition, the simulation results, in turn, can guide the film deposition process, so as to control the size of nano channel.