Open AccessSelection of Surfactants for Hydrogen peroxide-oxalic acid Polishing Slurry in Chemical Mechanical Polishing of 304 Stainless Steel
Author(s) -
Yongsheng Wang,
Haixu Liu,
Xin Cao,
Zhankui Wang,
Jianxiu Su
Publication year - 2020
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1681/1/012013
Subject(s) - pulmonary surfactant , slurry , hydrogen peroxide , oxalic acid , polishing , materials science , surface roughness , chemical mechanical planarization , sulfate , chemical engineering , sodium dodecyl sulfate , metallurgy , chemistry , composite material , inorganic chemistry , chromatography , organic chemistry , engineering
Stainless steel material will become one of the main materials for flexible large-size display substrates. Chemical mechanical polishing (CMP) will be one of the most practical processing technologies to achieve super smooth, non-damaged stainless steel surface. In this paper, the effects of different surfactants on material removal rate and surface roughness were studied. The results show that when adding the surfactant of the sodium hexadecyl sulfate in CMP slurry, the MRR was significantly higher than the other two kinds of surfactants. When the content of the sodium hexadecyl sulfate was 0.04wt%, the MRR reached the Maximum. When the content of the sodium hexadecyl sulfate was 0.2 wt%, the surface roughness reached the Minimum. So, the sodium hexadecyl sulfate is selected as the surfactant of the hydrogen peroxide-oxalic acid type CMP slurry.