Open AccessSelection of Abrasive for Chemical Mechanical Polishing of the 304 Stainless Steel
Author(s) -
Jianxiu Su,
Haixu Liu,
Qi Wanting,
Xin Cao,
Zhankui Wang
Publication year - 2020
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1681/1/012011
Subject(s) - abrasive , slurry , chemical mechanical planarization , materials science , polishing , surface roughness , metallurgy , corundum , machining , surface finish , composite material
Chemical mechanical polishing (CMP) technology is widely used in ultra-precision machining of various materials, and the abrasive are an important component of CMP slurry. In this paper, the effects of the abrasive type, the abrasive size and its concentration on material removal rate (MRR) and surface quality in CMP 304 stainless steel were studied through a series of experiments. The results show that the MRR in CMP 304 stainless steel using slurry with the white corundum abrasive is the highest, and the MRR in CMP 304 stainless steel using slurry with the silica abrasive is the lowest, but the surface quality in CMP 304 stainless steel using slurry with the silica abrasive is the best. The MRR and surface roughness increase with the increase of abrasive size, but the surface roughness increases slowly with the increase of abrasive size. With the increase of abrasive concentration, the MRR first increases and then decreases, while the surface roughness value changes slightly, indicating that the abrasive concentration in polishing slurry has little effect on the surface quality. These research results can provide a reference for the design of CMP slurry.