Open AccessMono and hybrid nanofluid based heat sink technologies - A review
Author(s) -
A Chandravadhana,
Vinoth Nandakumar,
K. Venkatramanan
Publication year - 2020
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1644/1/012048
Subject(s) - nanofluid , heat sink , heat transfer , pressure drop , mechanical engineering , materials science , work (physics) , heat flux , microchannel , computer science , mechanics , engineering , nanotechnology , physics
This paper presents a review of mono and hybrid nanofluid using heat sink technologies, which is the foremost task of new generation technology in cooling electronic devices. Heat generation in a tiny electronic device is the main factor to be prevented to enhance the heat transfer. One prominent remedy for this problem is to adopt mono and hybrid nanofluid based microchannel heat sinks are considered to be the recent trends.In this article, a state-of-the-art review of heat sinks, nanofluids preparation and characterization techniques have been carried out. The study begins with an overview of the heat sink, designing parameters, research work carried out in the last decade using mono nanofluids and hybrid nanofluids followed by the analysis of the research work carried out in the last decade in terms of different geometries of MCHS to examine the diverse factors like pressure drop, heat transfer coefficient, and critical heat flux. Current challenges and opportunities for future research are presented as well.