
Simulation analysis of electromagnetic-temperature field coupling of medium voltage switchgear based on finite element method
Author(s) -
Peng Li,
Tingbo Jia,
Zhongyu Zhang,
Wentao Li,
Yang Gao,
Zheng Nan
Publication year - 2020
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1639/1/012032
Subject(s) - switchgear , finite element method , electromagnetic field , voltage , electric field , coupling (piping) , field (mathematics) , electrical engineering , engineering , mechanics , electronic engineering , mechanical engineering , physics , structural engineering , mathematics , quantum mechanics , pure mathematics
In order to study the electric field distribution and temperature distribution of medium-voltage switchgear under normal operating conditions, taking 10kV switchgear as an example. Firstly, a three-dimensional physical model was established based on the solid structure of the switchgear. Secondly, the switchgear was made using the finite element method to simulate and analyze the electromagnetic field and temperature field. Consider various factors that affect the electric field distribution, and obtain the electric field distribution inside the switchgear and the temperature field distribution map on the current-carrying circuit.