Preface

Preface/Introduction International Conference on Thermal Sciences and Fluid Flow (ICTSFF) 2020 is co-organised by MN Smart Solution, Malaysia and Akademia Baru Publishing, Malaysia in collaboration with Sri Ramakrishna Institute of Technology, India and Rajamangala University of Technology Srivijaya, Thailand. This conference provides lots of networking opportunities to scholars, professors and practitioners for corporate and development sectors. The scope of this conference is broad and covers many aspects of international technology perspectives. This conference aims to provide scholarly platform to participants to share their valuable knowledge and current information with others. The conference is expected to attract the participation of academics, researchers and professional practitioners of ‘sciences’ and ‘engineering’ in Malaysia and also abroad. Knowledge sharing of ideas among academics and professionals has the potential to bridge the gaps and build an understanding on the various aspects of ‘sciences’ and ‘engineering’ nationally or internationally. As concerns increased over the pandemic of Corona Virus Disease (COVID-19), the organising committee had changed the meeting of ICTSFF 2020 from a physical to virtual format. The meeting had moved to virtual instead of being postponed due to the fact that we do not know when the pandemic situation will be over, subsequently concerned about the safety of our participants. The dates of the virtual conference remained unchanged to the initial proposed dates, which are on 17-18 April 2020, held in Penang, Malaysia. The talks of each presenter are limited to not more than 10 minutes per presentation (including Q&A sessions). The participants are located in their own location, since the Restriction of Movement Order (RMO) had been imposed not only in Malaysia (starting from 18 March 2020), but also other parts of the world as a measure to curb the outbreak. Thus, we had used Google Meet as our main platform/technology to deliver the conference.