Open AccessSolder Joint Structure of Sn-58Bi Solder Paste with Epoxy-based Flux
Author(s) -
Qingyang Li,
Xiukang Yang,
Chengfei Li
Publication year - 2020
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1622/1/012098
Subject(s) - soldering , solder paste , materials science , epoxy , wetting , metallurgy , microstructure , joint (building) , dip soldering , curing (chemistry) , electronic packaging , composite material , wave soldering , structural engineering , engineering
Non-clean soldering technology and low temperature bonding will be of great significant for applications in electronic industry. A curable solder paste containing epoxy-based flux and Sn-58Bi solder powder was developed. The solder joint covered by cured epoxy shell can be obtained by soldering process. The thermal-curing process of the curable flux was monitored by DSC to ensure the wetting and metallurgical connection between Sn-58Bi and Cu substrate. The microstructure characteristics of the solder joints were analyzed by metallurgical analysis and SEM observation. The factors influencing the structure of the solder joints were analyzed and discussed.