Open AccessStudy on Dispersant of Hydrogen Peroxide-Oxalic Acid Polishing Slurry in Chemical Mechanical Polishing of 304 Stainless Steel
Author(s) -
Yongsheng Wang,
Rui Xu,
Wang Yipu,
Zhankui Wang,
Jianxiu Su
Publication year - 2020
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1622/1/012097
Subject(s) - dispersant , sodium hexametaphosphate , chemical mechanical planarization , materials science , slurry , polishing , hydrogen peroxide , surface roughness , composite material , metallurgy , silicone , sodium , chemistry , dispersion (optics) , physics , organic chemistry , optics
Flexible display has become a research hotspot for next-generation display technology. Stainless steel materials will become one of the main materials for flexible large-size display substrates, and chemical mechanical polishing (CMP) technology will be one of the most practical processing technologies to achieve super-smooth, non-destructive surface of stainless steel material. In this paper, through a series of experiments, the material removal rate and surface roughness of hydrogen peroxide oxidizer under different dispersants and different dispersant contents were studied. The results shown that when the content of dispersant sodium hexametaphosphate is 1.2% wt, the material removal was the largest, which was 146nm / min. the surface roughness after CMP was relatively low, Ra = 10nm. Sodium hexametaphosphate was selected as the dispersant of the solution. The research results provided a reference for further study of 304 stainless steel chemical mechanical polishing fluid.