Open AccessSimulation of Solidification Process of BGA Tin-Lead Solder ball Based on Cellular Automaton Method
Author(s) -
Xiang Li,
Tianming Gao,
Shuhan Guo,
Li Yang,
Shixing Huo,
Hengrui Wang,
Shuai Li,
Tao Zhang,
Shu Li
Publication year - 2020
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1622/1/012054
Subject(s) - ball grid array , equiaxed crystals , materials science , soldering , cellular automaton , metallurgy , process (computing) , ball (mathematics) , tin , eutectic system , composite material , alloy , geometry , computer science , mathematics , algorithm , operating system
A method based on cellular automata was established to simulate the solidification process of solder balls used in ball grid array (BGA) packaging technology. For the uniform and constant temperature distribution inside the droplets, the equiaxed crystal morphology and the equiaxed crystal solute field were studied. The simulation results are also shown for solidification process with the BGA tin-lead solder ball prepared by uniform droplet spray (UDS) process under the condition that the cooling rate of is invariable.