Open AccessThe characterization and application of chip topside bonding materials for power modules packaging: a review
Author(s) -
Keming Liu,
Jinlong Yang,
Jian Luo,
Li Wang,
Quanquan Huang,
Fei Chen
Publication year - 2020
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1605/1/012168
Subject(s) - wire bonding , materials science , ribbon , reliability (semiconductor) , characterization (materials science) , power module , aluminium , electrical conductor , direct bonding , copper , thermal conductivity , electronic packaging , interconnection , chip , composite material , power (physics) , optoelectronics , nanotechnology , computer science , electrical engineering , metallurgy , engineering , computer network , physics , quantum mechanics , wafer
Bonding material is one weak point in power modules packaging, and can limit the lifetime of power modules. Multiple bonding materials have been manufactured and applied in the power modules such as aluminum wire, copper wire, aluminum ribbon, copper ribbon, Al-clad-Cu wire, direct-bonding-lead. For bonded power modules packging, bonding ability, electrical and thermal conductivity, current carrying capacity, working reliability are the main applying properties of bonding materials. This paper demonstrates the characterization, failure mode & failure mechanism, life-time calculation model of the normal used bonding materials and estimates the developing tendency.