Open AccessLumped parameter modelling of a thermoelectric cooler for high power electronics
Author(s) -
G. Casano,
S. Piva
Publication year - 2020
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1599/1/012046
Subject(s) - thermoelectric cooling , reliability (semiconductor) , experimental data , power (physics) , power electronics , set (abstract data type) , model parameter , evaporative cooler , electronics , computer science , mechanical engineering , thermoelectric effect , engineering , mathematics , thermodynamics , algorithm , electrical engineering , physics , statistics , programming language
A detailed analysis based on a lumped parameter model is presented of a cooling system for electronic equipments based on the combination of Peltier cells, air-cooling and liquid cold plate. A comprehensive model, specifically tailored for the cooling system under investigation, is introduced; the whole set of assumptions useful for the description of each element of the lumped parameter model, is described in depth. The model has been calibrated through an exhaustive comparison of numerical results versus experimental data, based on data gathered in experiments already published. Despite the large number of simplifying assumptions, the general good accordance between calculated and measured results demonstrate the reliability of the lumped parameter model, intended to be used for predicting the behaviour of the cooling system for currently untestable experimental conditions. Finally, the model is used as a useful design tool to investigate the cooling circuit under different operating conditions, in order to optimise the cooling solution here proposed.