Open AccessDielectric strength of insulating material in LN2 with thermally induced bubbles
Author(s) -
Dirk Gromoll,
Ralph Schumacher,
Christof Humpert
Publication year - 2020
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1559/1/012087
Subject(s) - materials science , boiling , composite material , dielectric strength , dielectric , liquid nitrogen , polypropylene , polyimide , layer (electronics) , thermodynamics , physics , optoelectronics , quantum mechanics
To realize a reliable and cost-effective application of high-temperature superconductive (HTS) equipment at high-voltage (HV) levels, the influence of thermally induced gas bubbles on the dielectric strength of different solid insulating materials in liquid nitrogen (LN 2 ) was investigated. A heatable copper tape electrode arrangement was developed simulating HTS tapes with insulation in between. AC breakdown measurements were performed without and with forced boiling on insulating papers, polypropylene laminated paper (PPLP) and polyimide (PI) films. Under nucleate boiling the influence of bubbles on the dielectric strength of all materials was not significant. However under film boiling the dielectric strength of the insulating papers decreased to a level comparable to their dielectric strength in air, demonstrating the insufficient impregnation of porous materials under film boiling. For PI there was no degradation at all. PPLP retained about 70% of its basic dielectric strength in LN 2 .