Open AccessSimulation of Hot Stamping Process Based on Deform Software
Author(s) -
He Huang,
Yao Lu
Publication year - 2020
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1549/3/032100
Subject(s) - hot stamping , stamping , mold , materials science , forming processes , die (integrated circuit) , deformation (meteorology) , software , finite element method , process (computing) , composite material , structural engineering , metallurgy , engineering , computer science , nanotechnology , programming language , operating system
Taking the U-shaped part of 22MnB5 ultra-high-strength steel as an example, a finite element model of hot stamping was established. The DEFORMV11.0 software was used to simulate the deformation process and the temperature field distribution of the sheet during hot forming. The results show that the temperature of the sheet varies with the different locations in the hot stamping process. The side wall of the sheet cools faster. Meanwhile, the temperature changes in the different positions of the concave mold and the convex mold are not uniform. The temperature change of the punch with the largest contact with the sheet is more obvious.