Open AccessMechanical stresses in aluminum nitride films formed by magnetron sputtering
Author(s) -
В. И. Струнин,
N. A. Chirikov
Publication year - 2020
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1546/1/012119
Subject(s) - materials science , nitride , argon , sputter deposition , aluminium , substrate (aquarium) , sputtering , cavity magnetron , nitrogen , nitrogen gas , composite material , physical vapor deposition , high power impulse magnetron sputtering , aluminium nitride , metallurgy , thin film , coating , layer (electronics) , nanotechnology , chemistry , oceanography , organic chemistry , geology
The results of studies of the dependence of the mechanical stresses of aluminum nitride (AlN) films obtained by direct current magnetron sputtering on the formation modes: substrate temperature, discharge power, ratio of nitrogen and argon fluxes at a pressure of 0.07 Pa are presented. It is shown that the minimum mechanical stresses are observed at a substrate temperature of 573-613 K, a power of 900 W and a gas ratio of 4/5 - 5/5, and are (15-22) * 10 8 N / m2.