Open AccessDevelopment of a μ-PIC with glass substrate aiming at high gas gain
Author(s) -
Mitsuru Abe,
T. Tanimori,
Atsushi Takada,
Yoshitaka Mizumura,
Shingo Komura,
T. Kishimoto,
T. Takemura,
Kei Yoshikawa,
Yuta Nakamura,
Y. Nakamasu,
Tomoyo Taniguchi,
Ken Onozaka,
Kazuya Saito,
Tetsuya Mizumoto,
S. Sonoda,
J. D. Parker,
K. Miuchi,
Tatsuya Sawano
Publication year - 2020
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1498/1/012002
Subject(s) - microelectromechanical systems , fabrication , printed circuit board , substrate (aquarium) , electrode , materials science , full width at half maximum , optoelectronics , resolution (logic) , high resolution , electrical engineering , nanotechnology , computer science , engineering , physics , remote sensing , medicine , oceanography , alternative medicine , pathology , quantum mechanics , artificial intelligence , geology
Micro pixel chambers ( μ -PICs), which are a type of the micro-pattern gas chambers, are usually manufactured using the printed-circuit-board (PCB) technology. However, recent application projects have begun to require higher gas gains and finer position resolution than those obtainable with current μ -PICs. It is difficult to improve the electrode structure to achieve these improvements because PCB technology limits the precision of electrode fabrication and the thickness of the substrate. We have therefore adopted micro-electro-mechanical-systems (MEMS) technology and developed the first prototype of a through-glass-via (TGV) μ -PIC. This prototype TGV μ -PIC worked well, achieving a maximum gain of approximately 20,000 and an energy resolution of 20.6% (FWHM) at 5.9 keV over the whole 5 × 5 cm 2 detection area.