Open AccessMolecular-dynamic study of processes at the interface of a flat metal heterostructure during its heating
Author(s) -
Е. И. Головнева,
И. Ф. Головнев,
А. В. Уткин,
V. M. Fomin
Publication year - 2019
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1404/1/012018
Subject(s) - heterojunction , perpendicular , interface (matter) , diffusion , materials science , metal , copper , condensed matter physics , optoelectronics , thermodynamics , composite material , metallurgy , physics , geometry , mathematics , capillary number , capillary action
The author applies the method of heating to a flat copper-silver heterostructure. An approach has been developed for carrying out a meso-analysis: the study of the distribution of parameters such as temperature, concentration of atoms, etc. in the direction perpendicular to the interface. A parameter describing the diffusion of atoms across the interface during heating has been proposed and calculated.