Open AccessModeling the temperature distribution of multi-chip integrated circuits combining Wire-Bond and Flip-Chip technologies
Author(s) -
П. П. Борисков,
N. Yu. Ershova,
Vadim Putrolaynen,
Pavel Seredov,
Maksim Belyaev
Publication year - 2019
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1399/2/022036
Subject(s) - flip chip , chip , wire bonding , integrated circuit , electronic circuit , heat sink , electronic engineering , integrated circuit packaging , materials science , mechanical engineering , computer science , engineering , electrical engineering , layer (electronics) , optoelectronics , nanotechnology , adhesive
On the basis of finite-element computer modeling, the temperature distribution of a multi-chip integrated circuit was calculated in System on Package configuration, combining Wire-Bond and Flip-Chip technologies. Technical recommendations are suggested for choosing a compound, taking into account the continuous layer of the compound separating the active elements and the heat sink.