
Study of the bias voltage influence on the structure, texture and residual stresses in Ta coatings deposited on a copper substrate of inverted magnetron
Author(s) -
A. S. Lenkovets,
А. А. Лозован,
S. Ya. Betsofen,
А. В. Беспалов,
И. А. Грушин,
N. P. Ivanov
Publication year - 2019
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1396/1/012028
Subject(s) - materials science , residual stress , texture (cosmology) , copper , cavity magnetron , substrate (aquarium) , biasing , sputter deposition , composite material , residual , metallurgy , relaxation (psychology) , voltage , thin film , sputtering , electrical engineering , nanotechnology , geology , psychology , social psychology , oceanography , image (mathematics) , engineering , algorithm , artificial intelligence , computer science
The results of the study of the bias voltage effect on the structure, texture and residual stresses of Ta-coatings deposited using an inverted magnetron on a copper substrate are presented. It is shown that variations in residual stresses are non-monotonic, which is determined by the complex effect of the bias voltage on the process temperature, which affects both the formation of mechanical and thermal stresses and their partial relaxation.