Open AccessStudy of adhesion characteristic of a surface alloy formed by a low-energy high-current electron beam
Author(s) -
E. V. Yakovlev,
A. B. Markov,
D. A. Shepel,
В. И. Петров
Publication year - 2019
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1393/1/012152
Subject(s) - materials science , alloy , scanning electron microscope , layer (electronics) , cathode ray , composite material , deposition (geology) , substrate (aquarium) , adhesion , transition metal , electron , metallurgy , chemistry , paleontology , biochemistry , oceanography , physics , catalysis , quantum mechanics , sediment , biology , geology
In the present work, the adhesive strength of the surface alloy with different transition layer thickness was measured. A Ni-Cu surface alloy is formed using successive operations of Ni film deposition followed by mixing in a melted phase with the Cu substrate by a low-energy, high-current electron beam (LEHCEB). A different thickness of the transition layer was obtained by varying the thickness of Ni film deposited during the formation of the surface alloy. The study includes characterization of formed Ni-Cu surface alloys by scanning electron microscopy, in-depth elements distribution and scratch test. The results obtained showed correlation with thickness of the transition layer and adhesive strength of the surface alloy.