Open AccessStructural features of the magnetron sputtered CuO/GDC anodes for solid oxide fuel cells
Author(s) -
A. A. Solovyev,
И. В. Ионов,
V. A. Semenov,
А. В. Шипилова,
С. В. Работкин
Publication year - 2019
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1393/1/012140
Subject(s) - materials science , crystallinity , annealing (glass) , oxide , chemical engineering , sputter deposition , anode , microstructure , calcination , microcrystalline , thin film , solid oxide fuel cell , scanning electron microscope , cavity magnetron , reducing atmosphere , analytical chemistry (journal) , mineralogy , metallurgy , composite material , nanotechnology , sputtering , crystallography , chemistry , electrode , biochemistry , chromatography , engineering , catalysis
The paper presents the results of the research of structure of a thin film CuO/Ce 0.9 Gd 0.1 O 2-δ (CuO/GDC) anode for solid oxide fuel cells (SOFCs) prepared by magnetron sputtering. Cu-based anode materials of SOFCs are of great interest because they exhibit greater tolerance to sulfur-containing fuels than the widely used Ni-based composite anodes. After deposition, annealing in air and reducing atmospheres, the composition, microstructure and crystallinity of the films were characterized using energy dispersive X-Ray spectroscopy, scanning electron microscopy and X-ray diffractometry, respectively. The as-deposited film consists of cubic fluorite structures of GDC and Cu 2 O and has a dense, homogeneous structure, in which Cu is evenly distributed over the volume of the film. However, it was shown that, strong Cu segregation is observed in CuO/GDC films, after reduction in hydrogen at a temperature of 750 °C, with the formation of massive agglomerates on the surface. The influence of pre-calcination of the as-deposited films at 1000 °C and 1200 °C on their structure was studied. It is shown that annealing at a temperature of 1000 °C does not prevent the agglomeration of Cu in a reducing atmosphere, while Cu evaporation is observed if annealing temperature is 1200 °C.