Open AccessExperimental research on the thermal conductivity of the contact pads for electronic equipment
Author(s) -
A A Sukhikh,
Konstantin Kuznetsov,
С. В. Скородумов
Publication year - 2019
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1385/1/012039
Subject(s) - gasket , thermal conductivity , materials science , electronics , mechanical engineering , thermal , heat transfer , raw material , electronic component , composite material , process engineering , electrical engineering , engineering , mechanics , thermodynamics , physics , chemistry , organic chemistry
Currently, soft contact pads of foreign manufacturers of SIL-Pad, Gap-Pad and Bond-Play series are widely used to transfer heat flows in electronic equipment elements. Within the framework of import substitution programs, the technology of manufacturing analogs of heat-conducting gaskets from local raw materials is being developed. The main thermal property that determines the performance of gaskets is the thermal conductivity. The article describes the installation, technique and methods of conducting and processing the results of experiments developed for its determination. The analysis of the obtained experimental data is made.