Open AccessThermal conductivity and thermal diffusivity of the melt Bi-Pb-Sn-Cd at high temperatures. computer experiment
Author(s) -
Н. М. Барбин,
И. В. Тикина,
D. I. Terentyev,
С. Г. Алексеев
Publication year - 2019
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1382/1/012177
Subject(s) - thermal diffusivity , thermal conductivity , materials science , thermodynamics , thermal , thermal conductivity measurement , coolant , analytical chemistry (journal) , chemistry , composite material , physics , environmental chemistry
The method of thermodynamic simulation is used to determine the thermal diffusivity and the thermal conductivity of the melt 42 mass.% Bi-40.6 masses.% Pb-10 Macc.% Sn-7.4 mass % Cd depending on temperature. It was found that the thermal conductivity and thermal diffusivity of melts Bi-Pb-Sn-Cd, Bi-Pb-Sn, Bi-Pb differ by no more than 15%. The obtained values indicate the prospects of using this melt as a coolant.