Open AccessFundamental issues related to flow boiling and condensation in microchannels – experimental challenges and opportunities
Author(s) -
В. В. Кузнецов,
А. С. Шамирзаев
Publication year - 2019
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1369/1/012043
Subject(s) - refrigerant , heat transfer , boiling , heat sink , flow boiling , boiling heat transfer , materials science , condensation , critical heat flux , microelectronics , microchannel , mechanics , thermodynamics , mechanical engineering , heat exchanger , heat transfer coefficient , engineering , nanotechnology , physics
In recent years, application of the microchannels has received considerable attention due to their capability for thermal management of microelectronic equipment, high power devices and development of compact evaporators. The present paper focuses at a discussion of the heat transfer during flow boiling and condensation in microchannels of the heat sink to identify the methods to improve heat transfer performance and select the physically based models for heat transfer prediction. The main purpose of this study is to discuss the mechanisms of heat transfer in microchannels at different aspect ratio for the three-sided heating case using the experimental data were obtained for refrigerant R134a and dielectric fluid.